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N845-M30
M.2 PCIe
256GB / 512GB
- Supports PCIe Gen3x4 interface and is compatible with the latest M.2 specifications (length: 30mm)
- Supports NVMe 1.4 protocol
- Supports SLC caching technology and significantly increases computing efficiency
- Built-in LDPCC ECC for error correction
- Supports HMB technology
- S.M.A.R.T. function (exclusive smart tool software developed by TEAMGROUP)
- Excellent durability with 3,000 wearleveling counts to support high workloads efficiently
PCI-e interface – supports the latest NVMe 1.4 protocol and is compatible with the latest M.2 specifications (length: 30mm)
N845-M30 adopts NVMe 1.4 express protocol and is equipped with PCIe Gen 3x4 transmission channel. Maximum sequential read/write speeds reach up to 3,100 and 1,800 MB/s respectively, and the transmission speeds are 3 times faster than that of SATA 6Gb/s interface. It comes in the M.2 2230 size and design, making it an ideal option for light industrial devices and mobile computing systems.
Latest 112-layer flash memory in the BiCS series
It adopts the latest BiCS 3D NAND technology that could stack up to 112 layers of flash memory, a 40% capacity increase per unit compared to the previous 96-layer 3D NAND to achieve cost optimization. The new design also enables better performance by increasing I/O efficiency by nearly 50%. It reduces latency and increases both storage efficiency and data protection capabilities.
Supports SLC Caching technology and significantly increases computing efficiency
SLC direct to TLC technology is used to segment the SSD. Designated sections simulate SLC to deliver higher transmission speeds, which strengthens the performance of industrial SSDs.
Supports HMB technology
It supports host memory buffer (HMB) technology which uses the host’s buffer to save images and enables read/write buffer by connecting to the host DRAM through PCIe interface. The cost of SSD is significantly reduced without the need for a built-in DRAM while the actual performance is superior to SSD products without add-on DRAM.
S.M.A.R.T. function (exclusive smart tool software developed by TEAMGROUP) (Taiwan invention patent no.: I751753)
Users can easily monitor product health and optimize performance with the tool. Its main function is to manage disk information, system information, and conduct read/write erformance tests. With S.M.A.R.T., users can check up on the industrial SSD's operational status anytime.
Interface
PCIe Gen3x4
Flash Type
3D TLC
Capacity
256GB / 512GB
Sequential R/W
3100 / 1800MB/s
Max. Power consumption
3.3V x 685mA
Dimension
30(L) x 22(W) x 3.5(H) mm
Shock
Operation: 50G/11ms (compliant with MIL-STD-202G Test condition A) Non-operation: 1500G/0.5ms (compliant with MIL-STD-883K Test condition B)
Vibration
Operation: 7.69 Grms, 20~2000 Hz/random (compliant with MIL-STD-810G General) Non-operation: 4.02 Grms, 15 ~ 2000 Hz/sine (compliant with MIL-STD-810G General)
MTBF
> 3 million hours
Storage Temperature
-55°C (-67°F) ~ +95°C (+203°F)
Operation Temperature
0°C (+32°F) ~ +70°C (+158°F)
-40°C(-40°F) ~ +85°C(+185°F)
-40°C(-40°F) ~ +85°C(+185°F)
Humidity
5% ~ 95%
P/E Cycle
3K P/E Cycles
Thermal Sensor
×
External DRAM Buffer
×
TRIM
✓
S.M.A.R.T.
✓
Warranty
3 years warranty
NOTES：
We reserve the right to modify product specifications without prior notice.
We reserve the right to modify product specifications without prior notice.
| Capacity | Team P/N |
|---|---|
| Standard Temp. | |
| 256GB | TE256GN845KM30 |
| 512GB | TE512GN845KM30 |
| Wide Temp. | |
| 256GB | TE256GN845KM30-W |
| 512GB | TE512GN845KM30-W |
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