With the evolution of the manufacturing process, 3D NAND flash can stack up to 112 layers of storage particles. The high stacking number can bring better storage space and transmission efficiency, and has a competitive advantage in cost. Team Group Inc. introduces it into a full series of Flash products, which can provide more diversified solutions for industrial applications.
 
Team Group Inc. adopts the brand-new 112-layer 3D TLC and the latest fifth-generation BiCS NAND flash memory, which increases the memory capacity by nearly 40% compared to BiCS4, and improves the I/O performance by about 50%, fully meeting the transmission needs for high-capacity and low-latency of edge computing. In order to fully meet a wide range of industrial application fields, Team Group Inc. provides a variety of mainstream specifications such as SATA and PCIe interface Gen3x4, etc. as well as a variety of capacity options, and offers the best professional support for various applications in the industry.
   

Related Products

S745-25

64GB / 128GB / 256GB / 512GB / 1TB / 2TB

T522 MSD

64GB / 128GB / 256GB / 512GB

T822 MSD

16GB / 32GB / 64GB / 128GB

N845-M30

256GB / 512GB / 1TB

N845-M42

256GB / 512GB / 1TB

N745-M80

128GB / 256GB / 512GB / 1TB

S745-M80

128GB / 256GB / 512GB / 1TB / 2TB

S745-M42

64GB / 128GB / 256GB / 512GB / 1TB

Home Technology Unique 112-Layer 3D TLC

Inquire

    Compare

      產品搜尋

      Please Enable cookies to improve your user experience

      We are committed to protecting your personal data in accordance with General Data Protection Regulation (GDPR) enforced by the European Union, and we will periodically update our Privacy Policy to comply with GDPR. Please refer to our latest version of Privacy Statement.
      We use cookies to improve your user experience and for web traffic statistics purposes. By continuing to use this website, please agree to our use of cookies.