N75A-M80 / N75G-M80
- Leading heat dissipation technology
- Durable Industrial-Grade 3D TLC
- Equipped with a cache DRAM
- Supports Error Correction Codes (ECC) Such as LDPC
- Global Wear Leveling Technology
- Supports S.M.A.R.T. Function (exclusive S.M.A.R.T. Tool software developed by TEAMGROUP)
- Supports AES256 bit Hardware Encryption/ TCG Opal 2.0 Security Subsystem Class
- Patented graphene/copper cooling technology-N75G
United States Patent (No.: US 110,513,92 B2)
Taiwan Invention Patent (No.: I703921)
China Utility Model Patent (No.: CN 211019739 U) - Patented aluminum fin cooling technology-N75A
Taiwan Utility Patent (number: M541645)
Graphene- 8.3% cooling
Aluminum-23.8% cooling
N75A/N75G has passed our rigorous internal laboratory tests and burn-in test. The patented ultra-thin graphene heat sink features graphene material with excellent thermal conduction performance, delivering heat dissipation rates of up to 8.3%. The patented high-strength aluminum fin heat sink features a unique thermal diversion design, capable of effectively reducing the temperature by up to 23.8%.
![proIns_img02 proIns_img02](https://industrial.teamgroupinc.com/upload/catalog_b/enL_catalog_23B08_hGxLZqdMZJ.jpg)
Leading heat dissipation solution
In response to the development of 5G communication, the increasing demand for smart edge computing and high-speed operation during 24 hours non-stop. The rugged industrial SSD, N75A-M80 and N75G-M80, equipped with patented heat sinks. Can be used in a limited space environment and provide excellent cooling performance, overcoming the extreme environments.
![proIns_img03 proIns_img03](https://industrial.teamgroupinc.com/upload/catalog_b/enL_catalog_23B08_75fAOdGxm1.jpg)
Exclusive patented heat dissipation technology
SSD outstanding performance and high endurance are well supported by patented aluminum fin and graphene heat sinks.
![proIns_img04 proIns_img04](https://industrial.teamgroupinc.com/upload/catalog_b/enL_catalog_23B08_6MyYxZ6yuO.jpg)
Wide temperature - Industrial high specification and durable 3D TLC chip, overcome the extreme environments
![proIns_img04 proIns_img04](https://industrial.teamgroupinc.com/upload/catalog_b/enL_catalog_23B08_HrEGTd1OF2.jpg)
2021 Computex d&i awards
2022 Taiwan Excellence Awards
Won the 2021 COMPUTEX d&i awards and 2022 Taiwan Excellence Awards, N75G-M80 is sole “industrial-grade”SSD product of the award-winning entries.
![proIns_img04 proIns_img04](https://industrial.teamgroupinc.com/upload/catalog_b/enL_catalog_23B08_pATnDOdYI8.jpg)
N75A-M80 : 80.0(L) x 23.4(W) x 12.9(H) mm (with Aluminum heat sink)
Non-operation: 1,500G / 0.5ms (compliant with MIL-STD-883K Test condition B)
Non-operation: 4.02 Grms, 15 ~ 2,000 Hz / sine (compliant with MIL-STD-810G General)
We reserve the right to modify product specifications without prior notice.
Model | Capacity | Team P/N |
---|---|---|
N75A-M80 | 128GB | TE128GN75AKM80-W |
N75A-M80 | 256GB | TE256GN75AMM80-W |
N75A-M80 | 512GB | TE512GN75AMM80-W |
N75G-M80 | 128GB | TE128GN75GKM80-W |
N75G-M80 | 256GB | TE256GN75GMM80-W |
N75G-M80 | 512GB | TE512GN75GMM80-W |