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N75A-M80 / N75G-M80
M.2 PCIe
128GB / 256GB / 512GB
- Leading heat dissipation technology
- Durable Industrial-Grade 3D TLC
- Equipped with a cache DRAM
- Supports Error Correction Codes (ECC) Such as LDPC
- Global Wear Leveling Technology
- Supports S.M.A.R.T. Function (exclusive S.M.A.R.T. Tool software developed by TEAMGROUP)
- Supports AES256 bit Hardware Encryption/ TCG Opal 2.0 Security Subsystem Class
- Patented graphene/copper cooling technology-N75G
United States Patent (No.: US 110,513,92 B2)
Taiwan Invention Patent (No.: I703921)
China Utility Model Patent (No.: CN 211019739 U) - Patented aluminum fin cooling technology-N75A
Taiwan Utility Patent (number: M541645)
Graphene- 8.3% cooling
Aluminum-23.8% cooling
N75A/N75G has passed our rigorous internal laboratory tests and burn-in test. The patented ultra-thin graphene heat sink features graphene material with excellent thermal conduction performance, delivering heat dissipation rates of up to 8.3%. The patented high-strength aluminum fin heat sink features a unique thermal diversion design, capable of effectively reducing the temperature by up to 23.8%.
Leading heat dissipation solution
In response to the development of 5G communication, the increasing demand for smart edge computing and high-speed operation during 24 hours non-stop. The rugged industrial SSD, N75A-M80 and N75G-M80, equipped with patented heat sinks. Can be used in a limited space environment and provide excellent cooling performance, overcoming the extreme environments.
Exclusive patented heat dissipation technology
SSD outstanding performance and high endurance are well supported by patented aluminum fin and graphene heat sinks.
Wide temperature - Industrial high specification and durable 3D TLC chip, overcome the extreme environments
2021 Computex d&i awards
2022 Taiwan Excellence Awards
Won the 2021 COMPUTEX d&i awards and 2022 Taiwan Excellence Awards, N75G-M80 is sole “industrial-grade”SSD product of the award-winning entries.
Interface
PCIe Gen3x4
Flash Type
3D TLC
Capacity
128GB / 256GB / 512GB
Sequential R/W
3,500 / 2,100MB/s
Max. Power consumption
3.3V x 1290mA
Dimension
N75G-M80 : 80.0(L) x 22.0(W) x 3.8(H) mm (with Graphene heat sink)
N75A-M80 : 80.0(L) x 23.4(W) x 12.9(H) mm (with Aluminum heat sink)
N75A-M80 : 80.0(L) x 23.4(W) x 12.9(H) mm (with Aluminum heat sink)
Shock
Operation: 50G / 11ms (compliant with MIL-STD-202G Test condition A)
Non-operation: 1,500G / 0.5ms (compliant with MIL-STD-883K Test condition B)
Non-operation: 1,500G / 0.5ms (compliant with MIL-STD-883K Test condition B)
Vibration
Operation: 7.69 Grms, 20~2,000 Hz / random (compliant with MIL-STD-810G General)
Non-operation: 4.02 Grms, 15 ~ 2,000 Hz / sine (compliant with MIL-STD-810G General)
Non-operation: 4.02 Grms, 15 ~ 2,000 Hz / sine (compliant with MIL-STD-810G General)
MTBF
> 3 million hours
Storage Temperature
-55°C (-67°F) ~ +95°C (+203°F)
Operation Temperature
Wide Temp: -40°C (-40°F) ~ +85°C (+185°F)
Humidity
5% ~ 95%
P/E Cycle
3K P/E Cycles
Thermal Sensor
✓
External DRAM Buffer
✓
TRIM
✓
S.M.A.R.T.
✓
Warranty
3-year limited warranty
NOTES：
We reserve the right to modify product specifications without prior notice.
We reserve the right to modify product specifications without prior notice.
| Model | Capacity | Team P/N |
|---|---|---|
| N75A-M80 | 128GB | TE128GN75AKM80-W |
| N75A-M80 | 256GB | TE256GN75AMM80-W |
| N75A-M80 | 512GB | TE512GN75AMM80-W |
| N75G-M80 | 128GB | TE128GN75GKM80-W |
| N75G-M80 | 256GB | TE256GN75GMM80-W |
| N75G-M80 | 512GB | TE512GN75GMM80-W |
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