In order to meet a large number of complex industry-used environments and high-performance computing, Team Group Inc. launches diversified heat dissipation products, which can effectively reduce the temperature of products, stabilize product performance and prolong service life.
With the emergence of the era of High Performance Computing, various rigid industrial applications, power loads of diversified platforms, and heat generation have risen simultaneously, resulting in a sharp increase of demands for heat dissipation of industrial products. Equipped with the patented heat dissipation technology, Team Group Inc.’s products, in addition to improving its own heat dissipation efficiency, aim at applications such as outdoor embedded and edge devices, Netcom, telecommunications and cloud devices, etc., in order to ensure the reliability, stability and product life of the system in high-speed computing and harsh temperature environments for a long time , to accelerate the realization of AIoT and the application process of edge high-performance computing.
 

Related Products

DDR5 UT U-DIMM

4800 / 5600

DDR5 UT SO-DIMM

4800 / 5600

DDR4 UT U-DIMM

2133 / 2400 / 2666 / 3200

DDR4 UT SO-DIMM

2133 / 2400 / 2666 / 3200

DDR3 UT SO-DIMM

1066 / 1333 / 1600 / 1866

DDR4 SO-DIMM

2400 / 2666 / 3200

DDR5 U-DIMM

4800 / 5600

N75A-M80 / N75G-M80

128GB / 256GB / 512GB

Home Technology Temperature Heat Dissipation

Inquire

    Compare

      產品搜尋

      Please Enable cookies to improve your user experience

      We are committed to protecting your personal data in accordance with General Data Protection Regulation (GDPR) enforced by the European Union, and we will periodically update our Privacy Policy to comply with GDPR. Please refer to our latest version of Privacy Statement.
      We use cookies to improve your user experience and for web traffic statistics purposes. By continuing to use this website, please agree to our use of cookies.