TEAMGROUP Industrial-grade SD Cards
Team Group industrial-grade memory cards built with top-quality SLC NAND Flash chips, can endure operating temperatures from -40°C to 85°C for industrial use and provide long-term performance even in the harshest conditions. These cards are the ideal solution for small form factor applications.
Interface
SD 2.0 / SD 3.0
Flash Type
SLC
Capacity
SD 2.0: 256MB / 512MB / 1GB / 2GB
SD 3.0: 4GB / 8GB
SD 3.0: 4GB / 8GB
Sequential R/W
SD 2.0: 3.3V x 70mA
SD 3.0: 3.3V x 76mA
SD 3.0: 3.3V x 76mA
Max. Power consumption
3.3V x 75mA
Dimension
15.0(L) x 11.0(W) x 1.0(H) mm
Shock
Operation: 50G / 11ms (compliant with MIL-STD-202G Test condition A) Non-operation: 1,500G / 0.5ms (compliant with MIL-STD-883K Test condition B)
Vibration
Operation: 7.69 Grms, 20~2,000 Hz / random (compliant with MIL-STD-810G General) Non-operation: 4.02 Grms, 15 ~ 2,000 Hz / sine (compliant with MIL-STD-810G General)
MTBF
> 3 million hours
Storage Temperature
-50°C (-58°F) ~ +95°C (+203°F)
Operation Temperature
Wide Temp.: -40°C (-40°F) ~ +85°C (+185°F)
P/E Cycle
60K
Ingress Protection
IP58
Warranty
5-year limited warranty
NOTES：
We reserve the right to modify product specifications without prior notice.
We reserve the right to modify product specifications without prior notice.
| Capacity | Team P/N |
|---|---|
| 256MB | TE256MD900XMSD-W |
| 512MB | TE512MD900XMSD-W |
| 1GB | TE1GD900XMSD-W |
| 2GB | TE2GD900XMSD-W |
| 4GB | TE4GD900XMSD-W |
| 8GB | TE8GD900XMSD-W |
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