DDR5 UT SO-DIMM

Wide temperature
4800 / 5600
  • High-Speed Industrial-Grade Dram Module of the New Generation
  • Patented Graphene Cooling Module (Taiwan Invention Patent I703921)
  • Patented IC Grade Verification Technology(Taiwan Invention Patent: I751093)
  • ES level and Industrial-Grade IC
  • Power Management ICs (PMICs) Equipped.
  • JEDEC Low Power 1.1V Standards
  • On-Die ECC for Stable System
  • Military-Grade Resistance to Shocks and Vibrations
  • ROHS/CE/FCC Standards

Patented Graphene Cooling Module

The patented cooling technology increases the cooling efficiency of the DRAM modules but also guarantees reliable, stable performance and a long product life under extreme temperatures and high-speed computing. Our patented cooling technology is the best solution for industrial applications of wide temperature DRAM and can achieve applications in AIoT and high-performance edge computing.
The industrial DDR5 series has undergone long-term endurance tests and burn-in tests at the TEAMGROUP lab. Results reveal that the product can achieve cooling effects of 3~5°C* at wide temperature environments (85°C).*

• US Invention Patent (No.: US11051392B2)
• Taiwan Invention Patent (No.: I703921)
• China Utility Model Patent (No.: CN 211019739 U)

*The experimental data is based on the test results of TeamGroup's internal laboratory, using DDR5 DIMM without heat sink and DDR5 IWT DIMM with graphene heat sink to test temperature data. The relevant test environment uses a wide temperature environment (85°C), and the actual temperature may vary according to different environmental conditions.

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Patented IC Grade Verification Technology

Exclusive IC grade verification technology is adopted in the series for effective IC frequency and temperature grading to ensure compatibility and durability in industrial applications on various equipment.

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ES level and Industrial-Grade IC

High-quality ES level IC is selected for the product series to ensure durability and reliability under industrial environments.

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On-die ECC for Stable System

Supports on-die ECCs, a feature that self-corrects DRAM cells for stability and reliability in systems.

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Power Management ICs (PMICs) Design for Effective Load Control

The power management functions have been transferred from the motherboard to the DRAM modules for effective load management, increased reliability and performance of the DRAM modules, optimized signals, and minimal interference.

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JEDEC Low Power 1.1V Standards

The DDR5 series requires a working voltage of only 1.1V, effectively reducing power consumption and heat production, making it great for low-power industrial systems.

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High-Speed Industrial Memory of the Next Generation

In the industrial DDR5 series, the fundamental frequency is drastically upgraded to 4800MHz . The industrial DDR5 series can be applied to 5G communications, edge computing, the Internet of Vehicles, servers, AI, industrial computers with embedded systems, and other industries.

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Frequency
4800 / 5600
Capacity
8GB / 16GB / 24GB / 32GB / 48GB
Pin Count
262pin
Width
64Bits
Voltage
1.1V
PCB Height
1.18 Inches
Ultra Operating Temperature
-40°C (-40°F) ~ +105°C (+221°F) (Ta)
Shock
Operation: 50G / 11ms (compliant with MIL-STD-202G Test condition A) Non-operation: 1,500G / 0.5ms (compliant with MIL-STD-883K Test condition B)
Vibration
Operation: 7.69 Grms, 20~2,000 Hz / random (compliant with MIL-STD-810G General) Non-operation: 4.02 Grms, 15 ~ 2,000 Hz / sine (compliant with MIL-STD-810G General)
Anti-Sulfuration
Optional
Gold Finger
3μ”
Value-Added Service
Conformal Coating
Warranty
Limited Lifetime
NOTES:
We reserve the right to modify product specifications without prior notice.

 
 
Frequency Capacity COMPONENT
COMPOSITION
RANK Team P/N
4800 8GB 1Gx16 1RX16 TE8GFSXV1AH-VP0G
4800 16GB 2Gx8 1RX8 TE16GFSXV1MH-VP0G
4800 32GB 2Gx8 2RX8 TE32GFSXV1MH-VP0G
5600 8GB 1Gx16 1RX16 TE8GFSXV2AH-VP0G
5600 16GB 2Gx8 1RX8 TE16GFSXV2MH-VP0G
5600 32GB 2Gx8 2RX8 TE32GFSXV2MH-VP0G
Name of Files
Type
Date Uploaded
Download
pdf
2023 / 02 / 13

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