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DDR5 CKD CU-DIMM
Embedded
6400
- High-Speed Industrial-Grade CKD-6400 Dram Module of the Next Generation
- Durable Sulfur-Resistant Storage Product (Taiwan Utility Model Patent: M611951)
- Power Management ICs (PMICs) Equipped
- JEDEC Low Power1.1V Standards
- ON-Die ECC for Stable System
- Military-Grade Resistance to Shocks and Vibrations
- ES level and Industrial-Grade IC
- ROHS/CE/FCC Standards
High-Speed Industrial CKD-6400 Memory of the Next Generation
The industrial DDR5 series can be applied industries , the fundamental frequency is drastically upgraded to 6400MHz . Through the CKD chip, the overall performance and stability could be leveled up.
Durable Sulfur-Resistant Storage Product (Taiwan Utility Model Patent: M611951)
The series is equipped with technologies for durable DRAM storage and complemented with sulfur-resistant pressure-resistant passive components and printed circuit boards for increased service life and compatibility with outdoor applications common in the new generation of industrial products.
Power management chip for stable and effective power usage
Power management chip minimizes noise interference, stabilizes power and distributes power to each electronic component effectively, supplying power to the system with stability and fastness.
JEDEC Low Power 1.1V Standards
The DDR5 series requires a working voltage of only 1.1V, effectively reducing power consumption and heat production, making it great for low-power industrial systems.
On-Die ECC for a more stable system
Supported with On-die ECC providing error correction and detection, the mechanism stabilizes the system while pursing performance.
ES level and Industrial-Grade IC
High-quality ES level IC is selected for the product series to ensure durability and reliability under industrial environments.
Frequency
6400
Capacity
8GB / 16GB / 24GB / 32GB / 48GB
Pin Count
288 pin
Width
64 bits
Voltage
1.1V
PCB Height
1.23 Inches
Standard Operating Temperature
0°C (32°F) ~ 70°C (158°F) (Ta +70°C / Tc +85°C)
Extended Operating Temperature
0°C (32°F) ~ 85°C (185°F) (TC +95°C)
Shock
• Operation: 50G/11ms (compliant with MIL-STD-202G Test condition A )
• Non-operation: 1500G/0.5ms (compliant with MIL-STD-883K Test condition B)
• Non-operation: 1500G/0.5ms (compliant with MIL-STD-883K Test condition B)
Vibration
• Operation: 7.69 Grms, 20~2000 Hz/random (compliant with MIL-STD-810G General)
• Non-operation: 4.02 Grms, 15 ~ 2000 Hz/sine (compliant with MIL-STD-810G General)
• Non-operation: 4.02 Grms, 15 ~ 2000 Hz/sine (compliant with MIL-STD-810G General)
Anti-Sulfuration
• Patent technology for durable storage products. (U.S. Patent No.: US 11439004; Taiwan Patent No.: 1771910)
• Patent IC Grading Testing and Verification Technology (U.S. Patent No.: US 11488679 B1; Taiwan Patent No.: I751093)
• Patent IC Grading Testing and Verification Technology (U.S. Patent No.: US 11488679 B1; Taiwan Patent No.: I751093)
Gold Finger
3u / 30u
Value-Added Service
Conformal Coating
Warranty
Limited Lifetime
NOTES：
We reserve the right to modify product specifications without prior notice.
We reserve the right to modify product specifications without prior notice.
| Frequency | Capacity | COMPONENT COMPOSITION |
RANK | Team P/N |
|---|---|---|---|---|
| 6400 | 8GB | 1Gx16 | 1RX16 | TE8GFLXV3AH |
| 6400 | 16GB | 2Gx8 | 1RX8 | TE16GFLXV3MH |
| 6400 | 24GB | 3Gx8 | 1RX8 | TE24GFLXV3TH |
| 6400 | 32GB | 2Gx8 | 2RX8 | TE32GFLXV3MH |
| 6400 | 48GB | 3Gx8 | 2RX8 | TE48GFLXV3TH |
Name of Files
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