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DDR4 UT SO-DIMM
Wide temperature
2133 / 2400 / 2666 / 3200
- Patented graphene cooling module
United States Patent (No.: US11051392B2)
Taiwan Invention Patent (No.: I703921)
China Utility Model Patent (No.: CN 211019739 U) - ES level and industrial particle IC
- Patented technology for durable storage (NO.: I771910)
- Patented IC grade verification technology (NO.: I751093)
- Military-grade resistance to shocks and vibrations
Patented graphene/copper cooling technology
- United States Patent (No.: US 110, 513, 92 B2)
- Taiwan Invention Patent (No.: I703921)
- China Utility Model Patent (No.: CN 211019739 U)
NOTES:The industrial Dram underwent long-term endurance tests and burn-in tests at the TEAMGROUP lab. Results revealed that the industrial Dram can perform continuous working for over 3 hours and achieves about 3-5% in cooling. The outstanding three-in-one heat dissipation is achieved through thermal conduction (graphene), heat radiation (graphene), and heat capacity (copper).The actual temperature changes may vary with different application conditions
ES level and industrial particle IC
High-quality ES level IC is selected for the product series to ensure durability and reliability under industrial environments.
Military-grade resistance to shocks and vibrations
The series is tested through MIL-STD-202G & MIL-STD883K shock testing and MIL-STD-810G vibration testing, guaranteeing durability and reliability under various industrial applications.
Leading the industry, ultra-wide temperature suitable for harsh environments
This product series uses TEAMGROUP IC sorting technology and is equipped with a patented graphene heat sink. It can operate at a maximum of 105°C to meet the needs of new-generation industrial applications. It can also ensure its performance and stability in rugged computers, fanless vehicle systems, etc.
Exclusive IC grade verification technology
Exclusive IC grade verification technology is adopted for the series for effective IC frequency and temperature (operating temperature up to 95℃) grading to ensure compatibility and durability in industrial application on various equipment.
Technology to deliver durable RAM (Taiwan Utility Model Patent M611951)
The series is equipped with technology that delivers a durable RAM for applications in extreme industrial conditions and a longer service life.
2022 Taiwan Excellence Awards
Won the 2022 Taiwan Excellence Awards, DDR4 WT DIMM is sole “industrial-grade”DRAM module product of the award-winning entries.
Frequency
2133 / 2400 / 2666 / 3200
Capacity
4GB / 8GB / 16GB / 32GB
Pin Count
260pin
Width
64Bits
Voltage
1.2V
PCB Height
1.18 Inches
Ultra Operating Temperature
-40°C (-40°F) ~ +105°C (221°F) (Ta)
Shock
Operation: 50G / 11ms (compliant with MIL-STD-202G Test condition A)
Non-operation: 1,500G / 0.5ms (compliant with MIL-STD-883K Test condition B)
Non-operation: 1,500G / 0.5ms (compliant with MIL-STD-883K Test condition B)
Vibration
Operation: 7.69 Grms, 20~2,000 Hz / random (compliant with MIL-STD-810G General)
Non-operation: 4.02 Grms, 15 ~ 2,000 Hz / sine (compliant with MIL-STD-810G General)
Non-operation: 4.02 Grms, 15 ~ 2,000 Hz / sine (compliant with MIL-STD-810G General)
Anti-Sulfuration
Optional
Gold Finger
3μ”
Value-Added Service
Conformal Coating
Warranty
Limited Lifetime
NOTES：
We reserve the right to modify product specifications without prior notice.
We reserve the right to modify product specifications without prior notice.
| Frequency | Capacity | COMPONENT COMPOSITION |
RANK | Team P/N |
|---|---|---|---|---|
| 2400 | 4GB | 512Mx8 | 1RX8 | TE4GHSXV4HH-VP0G |
| 2400 | 8GB | 1Gx8 | 1RX8 | TE8GHSXV4BH-VP0G |
| 2400 | 16GB | 1Gx8 | 2RX8 | TE16GHSXV4BH-VP0G |
| 2666 | 8GB | 1Gx8 | 1RX8 | TE8GHSXV6BH-VP0G |
| 2666 | 16GB | 1Gx8 | 2RX8 | TE16GHSXV6BH-VP0G |
| 2666 | 32GB | 2Gx8 | 2RX8 | TE32GHSXV6MH-VP0G |
| 3200 | 8GB | 1Gx8 | 1RX8 | TE8GHSXV3BH-VP0G |
| 3200 | 16GB | 1Gx8 | 2RX8 | TE16GHSXV3BH-VP0G |
| 3200 | 32GB | 2Gx8 | 2RX8 | TE32GHSXV3MH-VP0G |
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