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  • D900-W_MSD
  • D900-W_MSD
D900-W_MSD

D900-W MSD

SD Card
256MB / 512MB / 1GB / 2GB / 4GB / 8GB
  • Compliant SD Card Specification 2.0 / 3.0
  • SLC NAND Flash
  • Power fail management
  • Advanced wear leveling
  • Bad block mangement
  • Support Auto-Reflash
  • Support S.M.A.R.T. health monitoring
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TEAMGROUP Industrial-grade SD Cards

Team Group industrial-grade memory cards built with top-quality SLC NAND Flash chips,  can endure operating temperatures from -40°C to 85°C for industrial use and provide long-term performance even in the harshest conditions. These cards are the ideal solution for small form factor applications.

proIns_img03
Interface
SD 2.0 / SD 3.0
Flash Type
SLC
Capacity
SD 2.0: 256MB / 512MB / 1GB / 2GB
SD 3.0: 4GB / 8GB
Sequential R/W
SD 2.0: 3.3V x 70mA
SD 3.0: 3.3V x 76mA
Max. Power consumption
3.3V x 75mA
Dimension
15.0(L) x 11.0(W) x 1.0(H) mm
Shock
Operation: 50G / 11ms (compliant with MIL-STD-202G Test condition A) Non-operation: 1,500G / 0.5ms (compliant with MIL-STD-883K Test condition B)
Vibration
Operation: 7.69 Grms, 20~2,000 Hz / random (compliant with MIL-STD-810G General) Non-operation: 4.02 Grms, 15 ~ 2,000 Hz / sine (compliant with MIL-STD-810G General)
MTBF
> 3 million hours
Storage Temperature
-50°C (-58°F) ~ +95°C (+203°F)
Operation Temperature
Wide Temp.: -40°C (-40°F) ~ +85°C (+185°F)
P/E Cycle
60K
Ingress Protection
IP58
Warranty
5-year limited warranty
NOTES：
We reserve the right to modify product specifications without prior notice.

 
 
Capacity Team P/N
256MB TE256MD900XMSD-W
512MB TE512MD900XMSD-W
1GB TE1GD900XMSD-W
2GB TE2GD900XMSD-W
4GB TE4GD900XMSD-W
8GB TE8GD900XMSD-W

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